| 摘要 |
PROBLEM TO BE SOLVED: To improve the precision in measuring the temperature, to reduced the man-hours for attaching a temperature sensor, and to control the cost increase in an ultrasonic probe and an ultrasonic diagnostic apparatus. SOLUTION: The ultrasonic probe comprises a semiconductor substrate 1, a plurality of vibrators 10 formed on the semiconductor substrate 1, and at least one temperature sensor 6 formed on the semiconductor substrate 1. COPYRIGHT: (C)2007,JPO&INPIT
|
