发明名称 Heat dissipation device having low melting point alloy coating and a method thereof
摘要 A heat dissipation device having a layer of a low melting point alloy coating and a method of fabrication are described. A low melting point alloy material is heated to above its melting point, and the melted alloy material is sprayed onto the heat sink to form a coating layer right on the heat sink for a close contact with a heat source. Manufacturing time is conserved, manufacturing operations are simpler, and thermal conduction is improved.
申请公布号 US2006289092(A1) 申请公布日期 2006.12.28
申请号 US20050159257 申请日期 2005.06.23
申请人 CHAN CHUN-HOU 发明人 CHAN CHUN-HOU
分类号 B22D17/00;C21D9/00;H01L21/00;H05K7/20 主分类号 B22D17/00
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