发明名称 Extreme ultraviolet mask e.g. absorber mask having elevated sections and trenches, includes substrate with low coefficient of thermal expansion, multilayer and capping layer, where elevated sections are formed on continuous conductive layer
摘要 An extreme ultraviolet (EUV) mask having elevated sections and trenches, comprises a substrate having a very low coefficient of thermal expansion, a multilayer, and a capping layer. The elevated sections of are arranged on a continuous conductive layer. The mask is an absorber mask or an etched multilayer mask. An independent claim is included for producing the extreme ultraviolet mask of an etched multilayer type involving providing a structure having layers of substrate, multilayer, capping layer, buffer layer, absorber layer, and resist layer; writing to the resist layer; subjecting structure to a heat treatment process; developing the resist layer; removing uncovered sections of the absorber layer; removing the resist; examining the structure using a secondary electron microscope (SEM); removing the uncovered sections of the buffer layer; examining the structure to be obtained; repairing the defects possibly present; and final cleaning of the mask.
申请公布号 DE102005027697(A1) 申请公布日期 2006.12.28
申请号 DE20051027697 申请日期 2005.06.15
申请人 INFINEON TECHNOLOGIES AG;ADVANCED MASK TECHNOLOGY CENTER GMBH & CO. KG 发明人 KAMM, FRANK-MICHAEL;SCHWARZL, SIEGFRIED;HOLFELD, CHRISTIAN
分类号 G03F1/24;G03F1/84 主分类号 G03F1/24
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