| 摘要 |
The present invention belongs to a bonding technical field of biochips or micromechanical electrical devices, more specifically, to a novel method for bonding two solid planes containing silicon, oxygen, metal or other elements at a moderate temperature via surface assembling of active functional groups. The method includes the steps of: (1) cleaning and hydroxylating solid planes of silicon plate, quartz or glass; (2) aminating a hydroxylated surfaces of the substrate; (3) forming a mono-layer or multi-layer assembled film with compound monomers having an active bi-functional or multi-functional group on an aminated substrate surface; and (4) contacting two solid planes with a assembled film having the same or different active functional groups on its surface tightly, and forming covalent bonds at an appropriate temperature, pressure and a vacuum degree. Thus two solid planes are bonded with assembled films of bi-functional molecule or multi-functional molecule, thereby a bonding at molecular level of two solid planes are achieved.
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