| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a recording method for identifying individual semiconductor chips, and also, for achieving temporally and spatially efficient recording of the identification information on the semiconductor chips. <P>SOLUTION: When performing the exposure of a plurality of shots on the upper face of a wafer, to which a photo-sensitized material is applied, by using a mask having a plurality of reticles of a circuit pattern, a reticle number for identifying the reticle is exposed together in an exposure process. After that, a concave or convex reticle number is formed to the uppermost part of the wafer or a metal layer close to the uppermost part by executing the development and etching. Lower face identification information for allowing the identification in shot unit during the exposure is recorded on the lower face of the wafer in a marking process. An amount of the recordable information can be increased by recording the identification information after dividing it to the information for the upper face and that of for the lower face. The time required for recording can be reduced by recording the identification information in shot unit. <P>COPYRIGHT: (C)2007,JPO&INPIT |
