发明名称 |
ONE-COMPONENT HOT-SETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR MOUNTING UNDERFILL MATERIAL |
摘要 |
<p>The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like. <??>The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.</p> |
申请公布号 |
EP1384738(B1) |
申请公布日期 |
2006.12.27 |
申请号 |
EP20020708720 |
申请日期 |
2002.03.29 |
申请人 |
SUNSTAR GIKEN KABUSHIKI KAISHA |
发明人 |
GOTOH, JOHSHI;OKUNO, TATSUYA |
分类号 |
C08G59/42;H01L21/56;H01L21/60;H01L23/29;H01L23/31 |
主分类号 |
C08G59/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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