发明名称 |
Sensor usable in ultra pure and highly corrosive environments |
摘要 |
The electrical pin lead structure and brazing technique of the present invention provide a brazed lead in a sensor that adheres well to a semiconductor substrate while facilitating lateral flexibility without joint fatigue or breakage. In one example embodiment, the pin lead includes a coil head that is brazed to a silicon layer on a sapphire substrate using a silver-copper-palladium braze material. An advantage to this approach is the ability to both braze the pin lead to the diaphragm and seal the diaphragm to the ceramic backing plate with a high temperature glass in a single process step. Further, the palladium in the braze composition is a factor in reducing surface tension between the metal lead and semiconductor substrate during cooling to avoid stress fractures in the substrate.
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申请公布号 |
US7152478(B2) |
申请公布日期 |
2006.12.26 |
申请号 |
US20030440433 |
申请日期 |
2003.05.16 |
申请人 |
ENTEGRIS, INC. |
发明人 |
PETERSON THOMAS;DIAZ JORGE ANDRES DIAZ;CUCCI GERALD R. |
分类号 |
G01L7/08;G01K7/22;G01L9/00;G01L19/04;G01L19/06;H01L29/84 |
主分类号 |
G01L7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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