SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND ELECTRONIC EQUIPMENT

摘要

A semiconductor device includes a semiconductor chip having a bump and a wiring substrate having a land, wherein the bump and the land are connected through conductive particles dispersed in an insulating material. The bump includes a first conductive layer, a second conductive layer that is in contact with the first conductive layer, and a third conductive layer that is in contact with the second conductive layer. The conductive particles are inserted in the third conductive layer to establish the electrical connection.