发明名称 METHOD FOR FABRICATING IMAGE SENSOR
摘要 A method for manufacturing an image sensor is provided to completely remove a color resist with a simple operation such as changing spray time of a remover chemical. A wafer divided into a pixel array unit(P) and a logic circuit unit(L) is provided. A wire is formed on the wafer. An interlayer dielectric(161) is formed on the whole surface including the wire. A pad electrode(153) is formed on the interlayer dielectric of the logic circuit unit. A protective layer(165) is formed on the whole surface including the pad electrode. The protective layer on an upper portion of the pad electrode is selectively removed to form a via hole. A color photoresist is applied on the protective layer and is patterned to form a color filter layer. The color filter layer is removed by using a chemical. The color filter layer is reworked on the protective layer. A planarization layer is formed to cover the color filter layer. A micro lens is formed on the planarization layer to be corresponded to the color filter layer.
申请公布号 KR100660334(B1) 申请公布日期 2006.12.15
申请号 KR20050132101 申请日期 2005.12.28
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 CHO, IN BAE
分类号 H01L27/146 主分类号 H01L27/146
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