发明名称 |
METHOD FOR FABRICATING IMAGE SENSOR |
摘要 |
A method for manufacturing an image sensor is provided to completely remove a color resist with a simple operation such as changing spray time of a remover chemical. A wafer divided into a pixel array unit(P) and a logic circuit unit(L) is provided. A wire is formed on the wafer. An interlayer dielectric(161) is formed on the whole surface including the wire. A pad electrode(153) is formed on the interlayer dielectric of the logic circuit unit. A protective layer(165) is formed on the whole surface including the pad electrode. The protective layer on an upper portion of the pad electrode is selectively removed to form a via hole. A color photoresist is applied on the protective layer and is patterned to form a color filter layer. The color filter layer is removed by using a chemical. The color filter layer is reworked on the protective layer. A planarization layer is formed to cover the color filter layer. A micro lens is formed on the planarization layer to be corresponded to the color filter layer.
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申请公布号 |
KR100660334(B1) |
申请公布日期 |
2006.12.15 |
申请号 |
KR20050132101 |
申请日期 |
2005.12.28 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
CHO, IN BAE |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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