| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing semiconductor, which has excellent fluidity in molding, mold release characteristics and continuous moldability and excellent properties of solder reflow resistance. SOLUTION: The epoxy resin composition for sealing semiconductors is an epoxy resin composition which comprises (A) an epoxy resin, (B) a phenol-based resin, (C) a curing promoter and (D) an inorganic filler as main components and in which at least one of (A) the epoxy resin and (B) the phenol-based resin contains a resin of novolak structure having a biphenylene skeleton in a main chain. The epoxy resin composition comprises further (E)≥0.01 wt.% and≤1 wt.% of oxidized paraffin wax in the whole epoxy resin composition and (F)≥0.05 wt.% and≤0.5 wt.% of a silane coupling agent of a specific structure in the whole epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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