Testvorrichtung zur Ausführung eines Pulltests

摘要

Device comprises a pulling hook (7) that is positioned under a wire loop (5) formed between two bond contacts on the substrate (1) surface. Imaging means (40, 50) are provided to detect the highest point of the wire loop. Said means are linked to position control means (20, 30) that control automatic positioning and ensure that the hook is initially placed at the highest position of the loop.