| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip LED sealing a parallel connection of a plurality of LED elements in one package while preventing imbalance of current among the LED elements. <P>SOLUTION: In the chip LED mounting a plurality of LED elements on one small substrate, the plurality of LED elements are connected in parallel using a bonding wire having a resistance component in electrical connection between each electrode of the anode or cathode of the LED element and the electrode on the small substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT |
