| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to convey paired wafer while the wafers to be laminated is kept aligned, in consideration of the fact that alignment and electrode bonding are necessary to be performed by respective apparatuses, because the adjustment of an aligner is changed due to pressurization and accurate alignment becomes impossible when both processing steps are conducted by the same apparatus during manufacture of the laminated semiconductor device at wafer level, where the wafers to be laminated are aligned and electrode bonding accompanied with at least pressurization is performed. SOLUTION: Wafers are held by respective wafer holders, and the relationship among the wafers is fixed by a connection member fitted to the wafer holder. At that time, the connection member itself is not changed in the direction of the inside of wafer surface because of a working force between the connection members. For its sake, two parallel flat springs are actually used to fit the bonding member to the wafer holder. COPYRIGHT: (C)2007,JPO&INPIT
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