ELECTRONIC COMPONENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND LID MATERIAL FOR ELECTRONIC COMPONENT PACKAGE

摘要

[PROBLEMS] To provide an electronic component package in which a deposition layer excellent in heat resistance can be formed quickly between a lid and a case even if they are soldered at a low temperature. [MEANS FOR SOLVING PROBLEMS] The electronic component package comprises a case (1) having a recess in which an electronic component is contained and a lid (8) soldered to the case (1) through a deposition layer (20) such that the recess is closed. The case (1) has a first metal layer (5) formed of an Ni-Fe alloy containing 5.0-20 mass% of Fe at the outer circumference of the opening of the recess, and the lid (8) has a second metal layer (10) formed of the Ni-Fe alloy. The deposition layer (20) has a solder layer (12A) formed of a solder principally comprising Sn, and first and second intermetallic compound layers (5A, 10A) formed on both sides of the solder layer through diffuse reaction of Ni atoms and Fe atoms in the first and second metal layers (5, 10) and Sn atoms in the solder.