DIVIDING METHOD OF MICROWAVE CIRCUIT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a dividing method of a microwave circuit substrate capable of dividing the microwave circuit substrate with high accuracy without the need for highly accurately positioning the microwave circuit substrate and a dividing member. SOLUTION: The dividing method of the microwave circuit substrate includes steps of: forming a first groove 11 of nearly a trapezoidal shape wherein the cross-sectional shape of the groove 11 is opened toward one side of the substrate to the one side 1a of the microwave circuit substrate 1; forming a notch 12 of nearly a V-shape to the bottom face 11b of the first groove 11; locating the part of the microwave circuit substrate 1 formed with the first groove 11 between the dividing member 4A and a support base 5A; covering the first groove 11 of the one side 1a of the microwave circuit substrate 1 with a first resilient body 2, and applying a second resilient body 3 to the side of the other side 1b opposite to the first groove 11; and clamping the part of the microwave circuit substrate 1 formed with the first groove 11 between the dividing member 4A and the support base 5A. COPYRIGHT: (C)2007,JPO&INPIT