发明名称 METHOD FOR FORMING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a pattern, by which the pattern to be formed has a high degree of freedom and a novel unevenly-patterned plane is obtained and which contributes to the reduction of waste. SOLUTION: A coating material, which contains a water-soluble resin and a granular substance of 30-80 wt% as essential components and has 50-95 wt% solid content, 50-1,500 Pa-s viscosity and≥3.0 thixotropy index, is applied to a base material to form a coating film having 0.5-15 mm average thickness. An uneven pattern is formed by pressing a pressing tool having the width equal to or larger than the half of the average thickness of the coating film to the formed coating film before the coating material is dried. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006334525(A) 申请公布日期 2006.12.14
申请号 JP20050163341 申请日期 2005.06.02
申请人 SK KAKEN CO LTD 发明人 KURODA YOJI
分类号 B05D5/06;B05D3/00 主分类号 B05D5/06
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