发明名称 BISMUTH-BASED LEAD-FREE SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a bismuth-based lead-free sealing material which can be sufficiently softened and fluidized, has a high degree of crystallinity, and can not be again fluidized in a heating process after crystal deposition. SOLUTION: The sealing material contains bismuth-based lead-free glass having a composition comprising 30-60 mol% Bi<SB>2</SB>O<SB>3</SB>and 20-50 mol% ZnO, wherein the molar ratio of Bi<SB>2</SB>O<SB>3</SB>to ZnO is 1.0-3.0 and a ZnO-containing refractory ceramic filler powder. The preferable total amount of ZnO in the material is 10-50 mass%. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006335584(A) 申请公布日期 2006.12.14
申请号 JP20050159075 申请日期 2005.05.31
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 MASUDA NORIAKI
分类号 C03C8/24 主分类号 C03C8/24
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