| 摘要 |
A semiconductor device and a method for manufacturing the same are provided to manufacture a highly reliable semiconductor device. A semiconductor chip(20) is mounted on a wiring substrate. The semiconductor chip includes an electrode. The wiring substrate includes a base substrate(12) and a wiring(14). The wiring is formed on the base substrate. The wiring is contacted with the wire by heating and pressurizing to form eutectic alloy. The eutectic ally is formed in such a way that a part of the eutectic alloy is inserted between the wiring and the base substrate. A peeling portion(15) is formed by peeling a part of the wiring from the base substrate during the mounting process of the semiconductor chip on the wiring substrate. The eutectic alloy is inserted between the peeling portion and the base substrate. |
