| 摘要 |
PROBLEM TO BE SOLVED: To provide a testing tool capable of exactly and efficiently performing a tensile strength test for an external electrode formed on a semiconductor device regardless of a dimension of the external electrode, a testing device, and a testing method. SOLUTION: A testing tool 13 fixedly holding an external electrode 103 on a semiconductor chip 100 consists of a first member 1 and a second member 2 which are vertically piled each other and relatively move in the direction along mutually facing surfaces. There is formed on the first member 1 a through-hole 3 having a larger dimension than an outline of the external electrode 103. There is formed on the second member 2 a through-hole 4 or a notch having a larger dimension than the outline of the external electrode 103, and the external electrode 103 is sandwiched in an overlap 5 where the through-hole 3 and the through-hole 4 are overlapped. According to this, as a clamping condition can be freely adjusted according to the dimension of the external electrode 103, the microfabricated external electrode 103 can be certainly and fixedly held, and moreover various dimensions of external electrodes 103 can be used in common. Therefore, by using the testing device equipped with this testing tool 13, it is possible to perform the tensile strength test regardless of the dimension of the external electrode 103, and it is also possible to raise a testing efficiency. COPYRIGHT: (C)2007,JPO&INPIT
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