| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make compatible both the readiness of bonding and stable power supply in a semiconductor device wherein external connection pads are disposed in a plurality of pad lines along the outer circumference of a semiconductor chip. <P>SOLUTION: In the semiconductor device, a part or the entire of external connection pads are disposed in a plurality of pad lines. At least three IO cells are held together and disposed as an IO cell for power supply or the ground, and an external connection pad for power supply or for the ground corresponding thereto is disposed in a region of an outermost pad line of the semiconductor chip or in a region including a region of an outermost pad line. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
