| 摘要 |
There is provided apparatus and methods for transferring semiconductor wafers, wherein some embodiments employ a guide body; a first transferring unit including a support reciprocatively slidibly connected to the guide body, and a central finger supported by the support; and a second transferring unit including a base; a driving unit disposed in the support; a ball screw rotated by the driving unit; a guide member connecting with the ball screw, wherein the guide member has an outer inclined surface; a lever in surface contact with the guide member to be rotated around its center by the inclined surface when the guide member moves; a plurality of slide members in contact with the lever and slidable on the guide shaft as the lever rotates; a plurality of connection members spaced from each other and engaging with the corresponding slide members; and driving fingers connected to the corresponding connection members.
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