| 摘要 |
<p>A method of forming a conductive pattern on a substrate comprises:
a) providing a substrate (1) carrying a conductive layer (2);
b) forming a first portion (3) of the conductive pattern by exposing the conductive layer to a laser and controlling the laser to remove conductive material around the edge(s) of desired conductive region(s) of the first portion; and,
c) laying down an etch resistant material (20) on the conductive layer, the etch resistant material defining a second portion of the conductive pattern, removing conductive material from those areas of the second portion not covered by the etch resistant material, and then removing the etch resistant material.</p> |
