<p>The described embodiments relate to features (905) in substrates (300) and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate (300) extending between a first substrate surface (302) and a generally opposing second substrate surface (303), and at least one feature (905) formed into the first surface (302) along a bore axis that is not transverse to the first surface (302).</p>
申请公布号
EP1729966(A2)
申请公布日期
2006.12.13
申请号
EP20050731317
申请日期
2005.03.29
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
CLARKE, LEO, JR.;ASCHOFF, CHRIS;ADDINGTON, CARY G.