METHOD FOR INSPECTING OF SEMICONDUCTOR DEVICE

摘要

A method for testing a semiconductor device is provided to improve precision of a defect test in a ball or a printed circuit board of the semiconductor device by obtaining a lighting image and a coaxial image. A light image is obtained as light image information(S10). A coaxial image is obtained as coaxial image information(S20). An annular image is obtained by subtracting the coaxial image information from the lighting image information(S30). A region between inner and outer diameters are uniformly divided(S40). A binary value of the divided region is analyzed(S50). It is judged whether there are pixels having a binary value of 1 in the divided regions(S60). When there is at least one pixel having a binary value of 1, it is judged that a corresponding region is a normal(S70). It is judged whether a rate of the normal region is equal to or greater than a set value(S80). When the rate of the normal region is equal to or greater than a set value, it is judged that a corresponding ball is normal(S90).