发明名称 |
HEAT SPREADER CONSTRUCTIONS, INTEGRATED CIRCUITRY, METHODS OF FORMING HEAT SPEADER CONTRUICTIONS, AND METHODS OF FORMING INTEGRATED CIRCUITRY |
摘要 |
<p>The invention includes a heat spreader having a base which has a perimeter surface surrounding a heat-receiving region. A frame portion interfaces the perimeter surface and has an opening traversing a thickness of the frame. The invention includes a method of forming a heat spreader construction by forming a base portion having a perimeter region surrounding a heat-receiving surface. An independent frame portion is joined to the base portion. The invention includes integrated circuitry having a heat spreader construction in thermal communication with a heat-generating device. The heat spreader has a base having a heat-receiving surface and a perimeter surface which interfaces a frame portion. The invention includes methodology for forming integrated circuitry which includes providing an integrated circuitry board having a heat generating device mounted thereon, and providing a multi-part heat spreader in thermal communication with the heat-generating device.</p> |
申请公布号 |
EP1731002(A2) |
申请公布日期 |
2006.12.13 |
申请号 |
EP20050735523 |
申请日期 |
2005.03.29 |
申请人 |
HONEYWELL INTERNATIONAL, INC. |
发明人 |
DEAN, NANCY, F.;RASIAH, IGNATIUS, J. |
分类号 |
H01L23/373;H01L23/04;H01L23/36 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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