| 摘要 |
A component supplying device (1) is provided with at least a wafer holder (2) and at least a first (6) and a second (7) component pick-up device, which are movable along a first (4) and a second (5) guide, respectively, which guides are arranged at an angle relative to one another. The first component pick-up device (6) is movable between a pick-up position (10) located near the wafer holder (2) and a first supply position (11), while the second component pick-up device (7) is movable between the pick-up position (10) and a second supply position (12). |
