发明名称 |
Composite material used in making printed wiring boards |
摘要 |
<p>A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. A printed wiring pattern is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces. <IMAGE></p> |
申请公布号 |
EP0996319(B1) |
申请公布日期 |
2006.12.13 |
申请号 |
EP19990308240 |
申请日期 |
1999.10.19 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
KATAOKA, TAKASHI;HIRASAWA, YUTAKA;YAMAMOTO, TAKUYA;IWAKIRI, KENICHIRO;HIGUCHI, TSUTOMU |
分类号 |
H05K3/00;H05K3/02;H05K3/10;H05K3/38 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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