发明名称 Method of forming contact hole and method of manufacturing semiconductor device
摘要 A method of forming a contact hole on a substrate by using a projection aligner comprising a lighting system including a light source, an aperture, and a condenser lens, a photo mask on which light from the lighting system is incident, and a projection lens for projecting the light from the photo mask onto the substrate, comprises forming a first photosensitive resist film on the substrate; exposing the first photosensitive resist film by using a photo mask in which mask patterns are cyclically arranged in a first direction and a second direction which is orthogonal to the first direction and a first aperture having light transmission parts arranged symmetrically with respect to a center point in the first direction; developing the exposed first photosensitive resist film to form first lines and linear spaces; forming a second photosensitive resist film on the substrate; exposing the second photosensitive resist film by using the photo mask and a second aperture having light transmission parts arranged symmetrically with respect to a center point in the second direction; and developing the second photosensitive resist film to form second lines and linear spaces which are orthogonal to the first lines and linear spaces.
申请公布号 US7148138(B2) 申请公布日期 2006.12.12
申请号 US20040969996 申请日期 2004.10.22
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MIMOTOGI SHOJI;NAKAMURA HIROKO;FUKUHARA KAZUYA;TANAKA SATOSHI;INOUE SOICHI
分类号 G03F7/26;H01L21/4763;G03F7/20;H01L21/027;H01L21/302;H01L21/3065;H01L21/461;H01L21/768 主分类号 G03F7/26
代理机构 代理人
主权项
地址