发明名称 Process for control of contours formed by etching substrates
摘要 The present invention provides a process for controlling the contour of a feature in a transition area made by etching a substrate. This process includes applying a patterned resist mask to the substrate to form a plurality of mask openings and mask land areas. The mask land areas are sized and spaced to a control the contour of a feature on the substrate.
申请公布号 US7147789(B1) 申请公布日期 2006.12.12
申请号 US20030662934 申请日期 2003.09.15
申请人 HUTCHINSON TECHNOLOGY INCORPORATED 发明人 MORLEY CATHERINE A.;SPONHOLZ MARK P.;YOUNG STEVEN R.;FANK STEVEN A.;BJORSTROM JACOB D.
分类号 B44C1/22 主分类号 B44C1/22
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