发明名称 |
Method of manufacturing a sealed electronic module |
摘要 |
A circuit board is inserted into an open-ended housing and potting material is dispensed onto the exposed face of the circuit board in a single step to seal the circuit board to the housing. One or more electrical interconnects such as a connector header or a ribbon cable attached to the circuit board extend upward through the potting material so that the potting material also forms an environmental seal around the electrical interconnects.
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申请公布号 |
US7146721(B2) |
申请公布日期 |
2006.12.12 |
申请号 |
US20040016230 |
申请日期 |
2004.12.17 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
HUNKELER HUGH R.;FORTUNE DUANE D. |
分类号 |
H05K3/30;B29C39/10;H01R12/00;H05K1/00;H05K3/28;H05K3/34;H05K3/36;H05K5/00;H05K5/06 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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