发明名称 Mask forming and removing method, and semiconductor device, an electric circuit, a display module, a color filter and an emissive device manufactured by the same method
摘要 A mask forming method that can reduce manufacturing cost is disclosed. The method forms a mask on the surface of a member to be processed in order to form a desired pattern using liquid material for patterning. The method also includes applying resist to the entire surface of the member to be processed, drying the applied resist, patterning by removing the resist in a pattern-formation area using photolithography, and heating the resist.
申请公布号 US7148148(B2) 申请公布日期 2006.12.12
申请号 US20020309198 申请日期 2002.12.04
申请人 SEIKO EPSON CORPORATION 发明人 MORI YOSHIAKI;MIYAKAWA TAKUYA;SATO MITSURU;ASUKE SHINTARO;TAKAGI KENICHI
分类号 H01L21/302;C25D5/02;C25D7/12;H01L21/027;H01L21/288;H01L21/311;H01L21/312;H01L21/768 主分类号 H01L21/302
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