| 摘要 |
In a multilayer stacked wiring board, wiring patterns formed of a conductive metal are formed on the both sides of an insulating board. The multilayer stacked wiring board is provided by stacking at least two double sided wiring boards, wherein the wiring patterns formed on the insulating board are connected through a conductive metal of a through hole penetrating the insulating board, and electrical connection is provided between the double sided wiring boards. The double sided wiring boards are electrically connected by connecting low-melting point conductive metal layers arranged on the surfaces of connecting terminals formed on stacking planes of the double sided wiring boards. At least two double sided wiring boards are bonded by a polyimide adhesive resin applied on parts other than the connecting terminal parts on the double sided wiring boards by selective screen printing. In this multilayer stacked wiring board, the multilayer stacked boards are surely stacked and the layers are surely electrically connected.
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