| 摘要 |
Disclosed is a method enabling soldering with good quality. The pressure in a vacuum chamber (2), wherein an object (10) with a solid solder containing tin only or tin and one or more components selected from silver, lead, copper, bismuth, indium and zinc is placed, is reduced to vacuum conditions. After removing the oxide film of the solder by generating a free radical gas, generation of the free radical gas is stopped and the temperature is increased to the melting point of the solder or higher in a non-oxidizing atmosphere, thereby melting the solder.
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