| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric direct converter that decreases friction between each of high temperature side electrodes and each of thermoelectric direct conversion semiconductor pairs, even when a displacement takes place between each of the high temperature side electrodes and each of the thermoelectric direct conversion semiconductor pairs due to thermal deformation, so that damages or breakages can thereby be prevented. SOLUTION: The thermoelectric direct converter 1 disclosed herein is provided with a plurality of paired thermoelectric direct conversion semiconductor 4; low temperature side electrodes 6 each joined with low temperature side ends of the thermoelectric direct conversion semiconductor pairs; a low temperature side insulation board 8 connected to the thermoelectric direct conversion semiconductor pairs via the low temperature side electrodes; the high temperature side electrodes 5 each located on the high temperature side ends of the thermoelectric direct conversion semiconductor pairs; a plurality of cover members 27 respectively covering the high temperature side electrodes 5; and a high temperature side insulation board 7 thermally connected to the high temperature side electrodes 5 via the high temperature side electrodes and the cover members, and slide members 28a, 28b are provided between each of the high temperature side electrodes and each of the thermoelectric direct conversion semiconductor pairs. COPYRIGHT: (C)2007,JPO&INPIT |
