| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for optical semiconductors suitably used for sealing an optical semiconductor element emitting ultraviolet rays that is suppressed in generation of a void or the like on sealing and gives a cured product exhibiting excellent transparency and suppressed deterioration in transparency by ultraviolet irradiation. <P>SOLUTION: The resin composition for optical semiconductors is mainly composed of an epoxy resin component, where the epoxy resin component has a light transmittance of at least 80% at an optical path length of 1 mm for light of a wavelength of 400 nm and has a viscosity of at most 1 Pa s at 25°C. <P>COPYRIGHT: (C)2007,JPO&INPIT |
