| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for actinic radiation irradiation desirable to realize improved throughput of machine, reduced gas consumption, and reduced installation space. SOLUTION: When a protective sheet T having an ultraviolet-curing adhesive A stuck to a wafer W is peeled by irradiating the adhesive A on the protective sheet T to lower its adhesiveness, the wafer W with the attached protective sheet T is adsorptively supported by a support member 3, and it is irradiated with an ultraviolet radiation from a UV lamp 2 while it is kept in this state. At this time, a nitrogen gas N is ejected from the gas ejection area GA adjoining to the adsorptively wafer supporting area SA of the support member 3. COPYRIGHT: (C)2007,JPO&INPIT |
