| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve heat radiation effect of a semiconductor device for making solder connection to a printed circuit board, and to prevent the lead terminals of a semiconductor device from generating a fracture or a crack in the solder connection part of the lead terminals caused by the vibration of transportation/movement of a product. <P>SOLUTION: In a printed circuit board 3 for a semiconductor device drive, a flexible part 8 is formed between a solder connection part 13 with the lead terminal 5 of the semiconductor device and other part 11 than the solder connection. Without mounting insulating substrates 10, such as glass epoxy material which constitutes the front/rear surface of the printed circuit board, the flexible part 8 is made into the flexible state of a thin film between an insulator 12 and copper foil 9 so as to absorb the distortion force applied to the lead terminal 5 of the semiconductor device or dynamic load caused by vibration. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
