| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing an electronic component in which the reliability of electric connection is improved while maintaining mechanical strength, electronic equipment and an electronic apparatus. SOLUTION: The package for housing the electronic component comprises: a substrate 101 where a loading part 102 for the electronic component 110 is provided and a plurality of notched parts 103 are formed in the outer periphery of a lower surface; a wiring conductor 104 led out from the loading part 102 to the lower surface of the substrate 101; and a plurality of connection pads 105 formed inside the plurality of notched parts 103 of the substrate 101 and electrically connected to the wiring conductor 104. The plurality of notched parts 103 are formed such that the ends reach the side face of the substrate 101 and the length and depth of each are gradually prolonged from the end to the center of the side of the lower surface of the substrate 101. COPYRIGHT: (C)2007,JPO&INPIT
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