发明名称 METHOD OF SUPPLYING POWER TO ELECTRODE, PLASMA SURFACE TREATMENT METHOD USING THIS POWER SUPPLYING METHOD AND PLASMA SURFACE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and apparatus of plasma surface treatment which can execute large area/equalizing processing by effectively solving a standing wave problem in application of VHF plasma and UHF plasma to a large area/equalization process. <P>SOLUTION: In the method and the apparatus, the outputs of a plurality of power sources each having a built-in high-frequency oscillator to be randomly phase-modulated by a random phase modulator are supplied to a pair of electrodes, thereby simultaneously generating a plurality of standing waves which are independent between the electrodes and never fluctuate in time/space, and the position of the antinode of each of the plurality of standing waves are individually controlled, thereby uniforming/equalizing the large area plasma. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006332709(A) 申请公布日期 2006.12.07
申请号 JP20060239927 申请日期 2006.09.05
申请人 MURATA MASAYOSHI 发明人 MURATA MASAYOSHI;MURATA YASUKO
分类号 H01L21/205;C23C16/505;H05H1/46 主分类号 H01L21/205
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