| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead-free system, and to provide a new composition and method for manufacturing a semiconductor device which maintains electric performance and adhesive property of solder. <P>SOLUTION: A thin film conductive composition comprises a conductive silver powder, a zinc-containing additive, and a lead-free glass frit, which are dispersed in an organic medium. Further, an electrode is formed from the composition, from which the organic medium is removed, the glass particles in which are sintered, and which is calcined. Still further, a method for manufacturing the semiconductor device from structure elements comprises a step for applying the thin film composition onto an insulating film, and a step for calcining a semiconductor, the insulating film, and the thin film composition to form the electrode, where the structure elements are the semiconductor having a p-n junction and the insulating film formed on a main surface. The semiconductor device is formed by the method descried in detail above, to be formed from the conductive thin film composition. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
