| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a varistor which enables flip-chip mounting or wiring bonding mounting. <P>SOLUTION: The varistor V1 comprises an element 1, a first external electrode 10, a second external electrode 20, and an internal electrode 30. The element 1 has a first element portion 3 and a second element portion 5. The internal electrode 30 is located between the first element portion 3 and the second element portion 5 such that it is sandwiched therebetween. The first external electrode 10 and the second external electrode 20 are formed on one outer surface of the first element portion 3 to oppose the internal electrode 30. The internal electrode 30 and the first and second external electrodes 10, 20 have regions 10a, 20a and 30a overlapping when viewed from the opposing direction. Overlapping regions 7 and 9 of the internal electrode 30 and the first and second external electrodes 10, 20 in the first element portion 3 exhibit varistor characteristics. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
