| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting hollow package which facilitates forming a semiconductor fillet to raise the solder bonding strength of the package to a substrate. SOLUTION: The non-lead semiconductor element mounting package has a hollow for mounting semiconductor elements. Leads have outer terminals extending in parallel to the mounting substrate surface, and the outer terminals have recesses, each formed in the upside direction of the outer terminal from its underside in a section of the extending top end of the outer terminal without including the side of the section. COPYRIGHT: (C)2007,JPO&INPIT
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