发明名称 |
SEMICONDUCTOR IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING SAME |
摘要 |
A CMOS type semiconductor image sensor module wherein a pixel aperture ratio is improved, chip use efficiency is improved and furthermore, simultaneous shutter operation by all the pixels is made possible, and a method for manufacturing such semiconductor image sensor module are provided. The semiconductor image sensor module is provided by stacking a first semiconductor chip, which has an image sensor wherein a plurality of pixels composed of a photoelectric conversion element and a transistor are arranged, and a second semiconductor chip, which has an A/D converter array. Preferably, the semiconductor image sensor module is provided by stacking a third semiconductor chip having a memory element array. Furthermore, the semiconductor image sensor module is provided by stacking the first semiconductor chip having the image sensor and a fourth semiconductor chip having an analog nonvolatile memory array. |
申请公布号 |
WO2006129762(A1) |
申请公布日期 |
2006.12.07 |
申请号 |
WO2006JP311007 |
申请日期 |
2006.06.01 |
申请人 |
SONY CORPORATION;IWABUCHI, SHIN;MOTOYOSHI, MAKOTO |
发明人 |
IWABUCHI, SHIN;MOTOYOSHI, MAKOTO |
分类号 |
H01L27/14;H01L27/00;H01L27/10;H01L27/146;H04N5/374;H04N5/378 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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