SUBSTRATE PROCESSING EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The sizes required for maintenance are reduced and an occupying floor area is reduced. In substrate processing equipment, a load lock chamber (41) and a transfer chamber (24) are arranged in this order in a case (11) from a rear side. The equipment is provided with a processing chamber (53) for processing a wafer (1) arranged on an upper part of the load lock chamber (41). On an area on the rear side of the transfer chamber (24) where the load lock chamber (41) is not arranged, an opening part (66) and an opening/closing means (67) for opening/closing the opening part (66) are arranged.