METHOD FOR FORMING FREE STANDING MICROSTRUCTURES

摘要

A method of forming free standing microstructures includes providing a substrate and forming a sacrificial layer on the substrate. A thin-film structural layer is then formed around and over the sacrificial layer. The sacrificial layer may be formed from an electrically conductive or non-electrically conductive material in certain embodiments of the invention. Nanometer-scale pores are then introduced through the thin-film structural layer by a non-lithographic method, such as anodic etching. Via the pores, at least a portion of the sacrificial layer is etched away or otherwise removed from underneath the thin-film structural layer. The free standing microstructures may be sealed by application of a sealing layer on top thereof. The microstructure may form an encapsulating cavity and provide integrated on-wafer packaging if separate microdevices are disposed inside the cavity. The entire process may be done at or near room temperature in some cases.