| 摘要 |
An electronic device includes a substrate 23 on which foot patterns 24 A, 24 B and a solder resist 25 are provided such that the foot patterns 24 A, 24 B are exposed from opening portions 27 A, 27 B in the solder resist 25, packaging parts 20 A, 20 B mounted on the substrate 23 by solder 26, and a sealing resin 29 formed on the substrate 23 to seal the packaging parts 20 A, 20 B, wherein a part (running-on portions 26 A, 26 B) of the solder 26 is constructed to run on an upper surface of the solder resist 25 under the packaging parts 20 A, 20 B. |
