POLYIMIDE FILM, POLYIMIDE METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME

摘要

A polyimide metal foil laminate that ensures a high adhesion of metal layer, being suitable for use as a material of high-density circuit substrate. In particular, there is provided a polyimide film characterized by having undergone a surface treatment with the use of an alkaline aqueous solution containing a permanganate. Preferably, the alkaline aqueous solution contains a hydroxide. Further, there is provided a polyimide metal laminate characterized in that on a surface of the polyimide film, there are superimposed a thermoplastic polyimide layer and a metal layer, and provided a process for producing the polyimide metal laminate.