发明名称 |
APPARATUS FOR SCANNING WAFER |
摘要 |
<p>An apparatus for scanning a wafer is provided to improve exposure efficiency at an edge of the wafer by moving a reticle stage and a wafer stage in an opposite direction and a perpendicular direction. A slit plate(120) makes a light incident from a light source(112) of a slit light. A reticle stage(140) supports a reticle(142) for transferring a circuit pattern on a wafer(w). A lens(150) reduces the light passing through the reticle to transmit it to the wafer. A wafer stage(160) supports the wafer. A driving direction of the reticle stage and the wafer stage is rotated to move the reticle stage and the wafer stage to a perpendicular direction. A first driving unit(162) moves the wafer stage to an x or y axis. A second driving unit(144) moves the reticle stage to the x axis or a y axis. A controlling unit(180) controls the first and second driving units.</p> |
申请公布号 |
KR20060125007(A) |
申请公布日期 |
2006.12.06 |
申请号 |
KR20050046766 |
申请日期 |
2005.06.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, HO SUNG |
分类号 |
H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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