| 摘要 |
An uncured thermosetting composition which is capable of curing upon exposure to actinic radiation is disclosed. The composition includes an acetal diepoxide of the formula: <CHEM> wherein R and R' are individually an aliphatic epoxy, or a cycloaliphatic epoxy; R1 and R4 are individually an alkyl, substituted alkyl, aryl, aryl alkyl; and R2 and R3 are individually hydrogen, alkyl, alkoxy, substituted alkyl aryl, alkyl aryl, and cyclic alkyl, as well as a photo initiator, and an inorganic filler. The composition of the invention may also include a second epoxy functional resin, a flexibilizer, and other adjuvants. Other aspects of the invention include the cured resin encapsulant and a method of recovering the resin from a circuit assembly. <IMAGE> |
