发明名称 APPARATUS FOR TRANSPORTING WAFER
摘要 A wafer transfer apparatus is provided to prevent a wafer drop and a wafer damage due to a screw release from a transport unit when a wafer is transferred by using guide fixing units having guide fixing pins and guide fixing grooves. A wafer is placed on a transport unit(100). A wafer guide(200) is screw-coupled on an upper surface of the transport unit to fix the wafer. Guide fixing units are formed on the transport unit and the wafer guide for the wafer guide not to move on the transport unit even if the screw coupling is released. The guide fixing units have guide fixing pins(210) and guide fixing grooves(220). The guide fixing pins get the wafer not to move. The guide grooves get the guide fixing pins to be inserted. The guide fixing pins are formed on a lower portion of the wafer guide. The guide fixing grooves are formed on the transport unit.
申请公布号 KR20060124966(A) 申请公布日期 2006.12.06
申请号 KR20050046682 申请日期 2005.06.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH, JEONG HAN
分类号 H01L21/68;B65G49/07 主分类号 H01L21/68
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